eMCP

Kingston eMCP Kingston offers a wide range of JEDEC standard eMCP components. eMCP integrates eMMC and low power DRAM into one small footprint package. This packaging simplifies system PCB design and speeds time to market. eMCP is an ideal memory solution for applications that require high-capacity storage and low power DRAM combinations, such as smartphones, tablets, wearable devices and car infotainment.

eMCP Part Numbers and Specifications

Part No Capacity eMMC Standard Package Size
04EMCP04-NL2DM627 4GB MLC eMMC + 4Gb LPDDR2 5.0 (HS400) 11.5 x 13 x 1.0 (162 Ball)
08EMCP04-NL2DT227 8GB TLC eMMC + 4Gb LPDDR2 5.0 (HS400) 11.5 x 13 x 1.0 (162 Ball)
08EMCP08-NL2DT227 8GB TLC eMMC + 8Gb LPDDR2 5.0 (HS400) 11.5 x 13 x 1.0 (162 Ball)
08EMCP04-EL3BT227 8GB TLC eMMC + 4Gb LPDDR3 5.0 (HS400) 11.5 x 13 x 1.0 (221 Ball)
08EMCP08-EL3BT227 8GB TLC eMMC + 8Gb LPDDR3 5.0 (HS400) 11.5 x 13 x 1.0 (221 Ball)
16EMCP08-EL3BT527 16GB TLC eMMC + 8Gb LPDDR3 5.0 (HS400) 11.5 x 13 x 1.0 (221 Ball)
16EMCP16-EL3DT527 16GB TLC eMMC + 16Gb LPDDR3 5.0 (HS400) 11.5 x 13 x 1.0 (221 Ball)

eMMC™

Kingston eMMC™ Kingston offers a variety of embedded memory products, including eMMC and DRAM components, to customers worldwide. These products are ideal for memory and storage for many embedded applications.

Kingston eMMC is an embedded, non-volatile memory system, comprised of both Flash memory and a Flash memory controller, which simplifies the application interface design and frees the host processor from low-level Flash memory management. eMMC is a popular storage component for many consumer electronic devices, including smartphones, tablets, PDAs, eBook readers, digital cameras and recorders, MP3 and MP4 players, electronic learning products, digital TVs, set-top boxes, Mobile Internet Devices and car infotainment. It is increasingly adopted in many industrial and embedded applications.

For developers, eMMC simplifies the interface design and qualification process, resulting in a reduction in time to market and facilitates support for future Flash device offerings

Small BGA package sizes and low power consumption make eMMC a viable, low-cost memory solution for mobile and other space-constrained products. The technology specifications of eMMC are managed by JEDEC, the global leader in developing open standards for the microelectronics industry.

eMMC Part Numbers and Specifications

Part No. Capacity eMMC Standard Package Size
EMMC04G-M627 4GB MLC 5.1 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC08G-M325 8GB MLC 5.1 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC16G-M525 16GB MLC 5.1 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC32G-M525 32GB MLC 5.1 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC64G-M525 64GB MLC 5.1 (HS400) 11.5 x 13 x 1.0 (153 Ball)

TLC eMMC

Triple-Level cell (TLC) NAND Flash eMMC has 3-bit per cell and allows for lower overall prices and increased storage capacities. TLC eMMC uses an advanced controller and improved firmware capabilities for improved endurance and reliability. TLC is an ideal memory solution for smartphones, set tip box, OTT box, tablets, smart devices and car infotainment.

TLC eMMC Part Numbers and Specifications

Part No. Capacity eMMC Standard Package Size
EMMC08G-T227 8GB TLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC16G-T527 16GB TLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC32G-T527 32GB TLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC64G-T525 64GB TLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)

I-Temp eMMC™

Kingston’s wide-temp eMMC product offers JEDEC eMMC 5.0 features and backward compatibility to previous eMMC standards. It has all of the advantages of standard eMMC and the operating temperature range of the device meets industrial operating temperature requirements (-40°C~85°C), making it an ideal storage solution for harsh outdoor environment applications. i.e. Industrial automation machine, transportation, IP Cam, ext.

I-Temp Part Numbers and Specifications

Part No. Capacity eMMC Standard Package Size
EMMC04G-W627 4GB MLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC08G-W325 8GB MLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC16G-W525 16GB MLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC32G-W525 32GB MLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)
EMMC64G-W525 64GB MLC 5.0 (HS400) 11.5 x 13 x 1.0 (153 Ball)

MCP

The Kingston MCP component comes with JEDEC standard ballout. It integrates SLC NAND Flash with LPDRAM inside one small footprint package. Its compact size and low power consumption make it an ideal memory solution for many IoT, wearable applications, digital camera, Gateway and mobile device. MCP with Industrial operating temperature range (-40°C~85°C) is also available.

MCP Part Numbers and Specifications

Part No. Capacity DRAM Speed Package Size
KSLCMAL2TA0M2A 2Gb SLC + 1Gb LPDDR2 800 Mbps 8 x 10.5 x 1.0 (162 Ball)
KSLCMBL2RA2M2A 4Gb SLC + 2Gb LPDDR2 800 Mbps 8 x 10.5 x 1.0 (162 Ball)
KSLCMBL2VA2M2A 4Gb SLC + 2Gb LPDDR2 1066 Mbps 8 x 10.5 x 1.0 (162 Ball)

I-Temp MCP Part Numbers and Specifications

Part No. Capacity DRAM Speed Package Size
KSLCMAL2TA0M2C 2Gb SLC + 1Gb LPDDR2 800 Mbps 8 x 10.5 x 1.0 (162 Ball)
KSLCMBL2VA2M2C 4Gb SLC + 2Gb LPDDR2 1066 Mbps 8 x 10.5 x 1.0 (162 Ball)

Embedded DRAM

Embedded DRAM Kingston DRAM components are designed to meet the needs of embedded applications and offer a low voltage option for reduced power consumption.

Standard Part Numbers and Specifications

Part No. Capacity DRAM Speed Package Size
D2516EC4BXGGB 4Gb (256*16) DDR3/3L 1.35V* 1600/1333 9 x 13.5 x 1.2 (96 Ball)
D5128EC4BPGGBU 4Gb (512*8) DDR3/3L 1.35V* 1600/1333 9 x 10.6 x 1.2 (78 Ball)

*Backward compatible to 1.5V VDD, VDDQ

I-Temp Part Numbers and Specifications

Part No. Capacity DRAM Speed Package Size
D2516EC4BXGGBI 4Gb (256*16) DDR3/3L IT 1.35V* 1600/1333 9 x 13.5 x 1.2 (96 Ball)
D5128EC4BPGGBUI 4Gb (512*8) DDR3/3L IT 1.35V* 1600/1333 9 x 10.6 x 1.2 (78 Ball)

*Backward compatible to 1.5V VDD, VDDQ

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